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INTEGRATION / CONNECTIVITY
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ANGSTROM Engineering
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Angstrom
Products
PVD PLATFORMS
Covap
SMALL BUT MIGHTY
Fixturing supports up to 100mm x 100mm substrates
QCM sensors carefully isolated to ensure there is no interference from adjacent source material
NEXDEP
A COMPACT, ECONOMICAL, FULL FEATURED PVD WORKHORSE
With its 400mm x 400mm baseplate
Electron Beam Evaporation and Thermal Evaporation
AMOD
With its 500mm x 500mm baseplate
NOT TOO BIG, NOT TOO SMALL…IT’S JUST RIGHT
Plasma & Ion Beam Processing
Sputtering
EVOVAC
Sputtering
RF, DC, pulsed DC, HIPIMS, and reactive. Circular, linear & cylindrical cathodes are available.
Electron Beam Evaporation
CVD PLATFORMS
LPCVD
Designed and manufactured to meet the high temperature and rapid cooling
THE TOOL YOU NEED TO STUDY AND UTILIZE GRAPHENE AND CARBON NANOTUBES
INTEGRATION / CONNECTIVITY
Glove Box Integration
non-PVD and PVD processes to be connected within a controlled environment
Total integration means that samples, in addition to the evaporated materials, can be loaded from the glovebox
Cluster Integration
cluster specific sequencing algorithm within Aeres
operate multi-module systems that can include cleaning stations, substrate and mask load locks